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Shenzhen Yideyi Technology Limited Company
Shenzhen Yideyi Technology Limited Company
Manufacturer from China
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5 Years
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Turnkey PCB Assembly (40)
PCB Assembly Service (37)
PCB Prototype Assembly (16)
Electronics PCB Design (22)
PCB Reverse Engineering (12)
EMS PCB Assembly (14)
Quick Turn PCB Assembly (12)
SMT PCBA (14)
Flex PCB Assembly (16)
Multilayer Printed Circuit Board (16)
Rigid Flex PCB (15)
3D Prototype Printing Services (12)
Box Build Assembly (16)
Double Sided PCB Assembly (17)
Through Hole PCB Assembly (8)
HDI PCB Board (8)
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High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias
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Product Categories
Turnkey PCB Assembly
[40]
PCB Assembly Service
[37]
PCB Prototype Assembly
[16]
Electronics PCB Design
[22]
PCB Reverse Engineering
[12]
EMS PCB Assembly
[14]
Quick Turn PCB Assembly
[12]
SMT PCBA
[14]
Flex PCB Assembly
[16]
Multilayer Printed Circuit Board
[16]
Rigid Flex PCB
[15]
3D Prototype Printing Services
[12]
Box Build Assembly
[16]
Double Sided PCB Assembly
[17]
Through Hole PCB Assembly
[8]
HDI PCB Board
[8]
Contact Now
Shenzhen Yideyi Technology Limited Company
City:
shenzhen
Country/Region:
china
Contact Person:
吴怡
View Contact Details
Contact Now
High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias
Products Detailed
HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias HDI PCB Board Capabilities include: Laser Drilled Microvias Sequential ...
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Product Tags:
metireal of pcb
high density interconnect pcb
pcb blind via