Shenzhen Yideyi Technology Limited Company
Shenzhen Yideyi Technology Limited Company
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ISO13485 Min Components Fast PCBA Prototype Electronics PCB Design
Shenzhen Yideyi Technology Co., Ltd is the most popular PCB manufacturing and assembly company based in China ,we have been offering full spec electronic manufacturing solutions for 13 years to meeting the needs of our customers from different industries in terms of cost-effectiveness, quality , delivery and any other requests. From PCB design, layout to PCB prototyping, mass fabrication and then to PCB assembly, electronics box-build assembly services, our Printed circuit boards are widely built into robotics, medical, automobile, communication, industry and consumer electronics.
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe.
Why choose us to manufacture your PCBs?
Profession, Quality, Responsibility
Online quote, order and tracking
PCB Fab with 24 hours express
PCB Assy with 12 hours express
Real One-stop PCB solution servcice
No MOQ, NO Set-Up Charges, NO NREs
24 hours non-stop tech support and production
Great quality approved by thousands customers all over the world
Advanced PCB factory Located in China's Silicon Valley - Shenzhen
PCBA Capability
PCB MANUFACTURE
We specialize in producing high-tech PCB prototype, fast delivery PCB and mass production PCB. Our products are cover with 2-40 layers Rigid PCB, 1-8 layers Flexible PCB and Rigid-Flex PCB, we are also manufacturing HDI PCB, High-frequency board and metal substrate which covers with multiple variety and processing ability. Our monthly output of product is about 1000 kinds of models with 20000 square meters; Our product delivery is about 95% on time. In addition, we pass the UL, CE, RoHS, ISO9001 etc. industrial certificates.
Transfer to Production
Nortech can help you make the transition from prototyping to production easy. We incorporate Design For Manufacturability (DFM) tools like Mentor Graphics Valor Software to conduct:
BOM checks (quantity to reference designation, reference designation duplication)
BOM to layout checks (layout matches parts, parts will not collide with each other upon placement, part locations relative to PCB features)
Fabrication checks (Copper stubs, vias in pads, spacing violations)
We are equipped with High-speed and accurately SMT Equipment ,and we provide a whole range of SPI,AOI,ICT,FCT,X-RAY,ROHS and aging testing for products.
All our shop floors are dust free, all lines are lead free, we are ISO9001 certified company.
We have made for customers:
FAQ:
Q1. How many types of surface finish we can do?
We has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. ..
OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.