Shenzhen Yideyi Technology Limited Company
Shenzhen Yideyi Technology Limited Company
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Fast PCBA Prototype Professional Engineering Team Physical PCBA
Shenzhen Yideyi Technology Co., Ltd established in 2008, located in Shenzhen, China, we produces a variety of printed circuit board assembly types: simple, typical, complex.
We offer the option for circuit board component kitting so you can buy only the components you need.
We handle any quantity: prototype PCB, short runs, up to large production runs of 10,000 or more.
One-Stop Fabrication and Assembly
Fast sample, high precision, complicated, high quality a turnkey start-to-finish solution : PCB Manufacturing + Components Sourcing + PCB Assembly + Testing, meets all your requirements.
PCBA Capability
| Items | PCBA capacity |
| Product name | SMT circuit board manufacturer custom electronic assembly pcb pcba |
| Assembly details | SMT and Thru-hole, ISO SMT and DIP lines |
| Testing on products | Testing jig/mold , X-ray Inspection, AOI Test, Functional test |
| Quantity | Min quantity : 1pcs. Prototype, small order, mass order, all OK |
| Files needed | PCB : Gerber files(CAM, PCB, PCBDOC) |
| Components : Bill of Materials(BOM list) | |
| Assembly : Pick-N-Place file | |
| PCB Panel Size | Min size : 0.25*0.25 inches(6*6mm) |
| Max size : 1200*600mm | |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine BGA Pitch to 0.2mm(8mil) | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component package | Cut Tape, Tube, Reels, Loose Parts |
| PCB+ assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity |
PCB assembly is a process which we put great emphasize on. We introduced automated placement equipments as well as X-ray inspection machine to guarantee the quality of PCB assembly.
After the assembly, we will carry out the functional test to inspect that whether the assembled PCBs work well.
We have robust SMA capabilities line which offers the following:
Capable of 40,000 placements per hour
Surface mount sizes start at 0201
BGA sizes range from micro to 2×2 inch machine placed
BGA repair equipment
X-ray
Flex/rigid circuits
Special capabilities: Plated through-hole technology, no-clean and aqueous cleaning processes, conformal coating
Our experience is anchored in aerospace electronics, medical, military, and commercial clients but we serve any industry
As the experienced quick turn pcb prototype factory china,
we provide one-stop pcba assembly service for customers of Iot pcba, smart home pcba, aerospace pcba, military pcba, communication pcba, industrial pcba, automotive pcba, medical pcba etc. over 10 years.
FAQ:
Q1. What kinds of boards can O-Leading process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.