Shenzhen Yideyi Technology Limited Company
Shenzhen Yideyi Technology Limited Company
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Smart Home Devices PCB Layout OEM Lead-Free Fast PCBA Prototype
Shenzhen Yideyi Technology Co., Ltd is a professional and reliable one-stop PCB solutions provider for customers specialized in manufacturing quick turn prototypes and small volumes. With high quality and on-time delivery products we won the market′s wide acclaim.
We will continue to focus on customer satisfaction, along with "high quality "and "fast delivery", we will become a PCB service provider worthy of customer trust.
PCB board file with parts list provided by customers:
* PCB sample made, circuit board parts purchased by us
* PCB board with parts assembled
* Electronic testing circuit board or PCBA
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
* One stop service for PCB layout, PCB manufacture, components purchasing, PCB assembly, test, packing and PCB delivery
* PCBA copy
PCBA Capability
| Board Type | Rigid, Flexible, Rigid-flexible |
| Base Material | FR4, High TG FR4, CEM1,CEM3,Aluminum, Rogers, Taconic |
| Layer Counts | 1-30L |
| Max Board Size | 1200*400mm |
| Board Thickness | 0.2-7mm |
| Min Hole Size (mechanical) | 0.15mm |
| Min Hole Size (laser) | 0.10mm |
| Controlled Tolerance | +/-5% |
| Copper Weight | 0.5-4oz |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp hole |
| Solder Mask | Double-sided green LPI,Also support Red,White,Yellow,Blue,Black |
| Silk Screen | Double-sided or single-sided in white,yellow,black,or negative |
| Surface Finish | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP |
How can we make high quality PCBA products?
1. Strict incoming material inspection control and management.
2. Never change BOM indicated material brand without customer’s permission.
3. Standard Operation Procedure.
4. PCB will be baked in the oven machine in advance.
5. Fully automatic, high precision SMT and test equipment.
6. Comprehensive testing includes AOI, X-Ray, ICT, software flashing according to different PCBA Boards.
YDY keeps pace with the times, has imported advanced X-RAY, 3D AOI, selective wave soldering, MADATA, YAMAHA etc equiments, we can provide original package componets agent service, custom pcb manufacturing, precise pcb assembly, accurate pcb printing, save your cost and time at the same time.
We can provide better pcba service for customers from Iot pcba aerospace pcba, military pcba, communication pcba, industrial pcba, medical pcba, automotive pcba etc.
FAQ:
Q1. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.