Shenzhen Yideyi Technology Limited Company
Shenzhen Yideyi Technology Limited Company
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FR-1 Automotive Pcba Printed Circuit Board Manufacturing V-CUT PCBA Prototype
Shenzhen Yideyi Technology Co., Ltd advanced PCB production and testing equipment purchased from the United States, Japan, Germany and other places to improve production testing and technical capabilities.
Adopting international advanced process technology and advanced management methods, the technological level is constantly improved from their high standards and strict requirements.
One-stop PCB and PCBA electronic manufacturing services:
1. PCB manufacturing service: Need Gerber file(CAM350 RS274X), PCB files(Protel 99,AD,Eagle),etc
2. Components sourcing services: BOM list included detailed Part number and Designator
3. PCB assembly services: The above files and Pick and Place files,assembly drawing
4. Programming & Testing services: Program,instrouction and test method etc.
5. Housing assembly services: 3D files,step or others
6. Reverse engineering services: Samples and others
7. Cable & wire assembly services: Specification & others
8. Others services: Value-added services
PCBA Capability
| Board Type | Rigid, Flexible, Rigid-flexible |
| Base Material | FR4, High TG FR4, CEM1,CEM3,Aluminum, Rogers, Taconic |
| Layer Counts | 1-30L |
| Max Board Size | 1200*400mm |
| Board Thickness | 0.2-7mm |
| Min Hole Size (mechanical) | 0.15mm |
| Min Hole Size (laser) | 0.10mm |
| Controlled Tolerance | +/-5% |
| Copper Weight | 0.5-4oz |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp hole |
| Solder Mask | Double-sided green LPI,Also support Red,White,Yellow,Blue,Black |
| Silk Screen | Double-sided or single-sided in white,yellow,black,or negative |
| Surface Finish | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP |
PRODUCT CONFIGURATION:
4/2 (optional 6-inch) image intensifier and megapixel digital camera;
90KV / 100KV-5 micron X-ray source
Simple mouse click operation to write detection program;
High detection repeat accuracy;
Rotational tilt of plus or minus 60 degrees allows unique perspectives to detect samples;
High-performance stage control;
Large navigation window-easy to locate and identify defective products;
Automatic BGA detection program accurately detects every BGA bubble
Make judgments according to customer needs and output Excel reports.
YDY keeps pace with the times, has imported advanced X-RAY, 3D AOI, selective wave soldering, MADATA, YAMAHA etc equiments, we can provide original package componets agent service, custom pcb manufacturing, precise pcb assembly, accurate pcb printing, save your cost and time at the same time.
We can provide better pcba service for customers from Iot pcba aerospace pcba, military pcba, communication pcba, industrial pcba, medical pcba, automotive pcba etc.
FAQ:
Q1. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.