Shenzhen Yideyi Technology Limited Company

Shenzhen Yideyi Technology Limited Company

Manufacturer from China
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5 Years
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4 Layers Rigid Flex Circuit Boards Fast Smt Contract Manufacturing

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Shenzhen Yideyi Technology Limited Company
City:shenzhen
Country/Region:china
Contact Person:吴怡
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4 Layers Rigid Flex Circuit Boards Fast Smt Contract Manufacturing

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Brand Name :YDY
Model Number :M-017
Certification :ISO13485, IATF16949, ISO9001,IOS14001
Place of Origin :China
MOQ :1pcs
Price :Negotiable
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :50000pcs/month
Delivery Time :1-15 working days
Packaging Details :Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
Service :Flex PCBA PCB
Type :4 Layers Fast Smt Contract Manufacturing Rigid Flexible PCB
Materials :RA copper, HTE copper, FR-4, polyimide, adhesive
Min. hole size :0.15-0.2mm
Copper thickness :0.3-3oz
Min. line width :0.075mm/0.1mm(3mil/4mil)
Component packaging :Cut Tape,Tube,Reels,Loose Parts
Minimum track and gap :0.075mm / 0.075mm
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4 Layers Fast Smt Contract Manufacturing Rigid Flexible PCB

We offer:

1. Smt Contract Manufacturing

2. Quick Turn Pcb Fabrication

3. Printed Circuit Board Soldering

4. Mid Volume PCB Assembly

5. Gerber File And BOM List

6. Dc Controller Pcb Board Assembly

7. Lead Free Pcb Assembly

8. Pcb Manufacturing With Components

9. Pcb Assembly Prototype Service

10. Printed Circuit Design & Fab Circuits Assembly

PCBA Capability

Min Trace Width (a)
0.075mm (3mil)
Min Space Width (b)
0.1mm (4 mil)
Min Annular Ring
0.1mm (4 mil)
SMD Pitch (a)
0.2 mm(8 mil)
BGA Pitch (b)
0.2 mm (8 mil)
Min Solder Mask Dam (a)
0.0635 mm (2.5mil)
Solder mask Clearance (b)
0.1mm (4 mil)
Min SMT Pad spacing (c)
0.1mm (4 mil)
Solder Mask Thickness
0.0007"(0.018mm)
Min Punch Hole Size
0.9 mm (35 mil)
Hole Size Tol (+/-)
PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol
±0.075mm
HASL
2.5um
Lead free HASL
2.5um
Immersion Gold
Nickel 3-7um Au:1-5u''
Panel Outline Tol (+/-)
CNC: ±0.125mm, Punching: ±0.15mm
Beveling
30°45°
Gold Finger angle
15° 30° 45° 60°
Certificate
ROHS, ISO9001:2008, SGS, certificate

A rigid flex printed circuit board (PCB) is a hybrid circuit board design that integrates elements from both hardboard and flexible circuits. Rigid flex PCBs are rigid at some points on the board and flexible at others. Because of this, rigid flex circuits can be folded or continuously flexed while maintaining the shape of areas that need extra support. The circuits are typically multi-layered and are comprised of flexible circuit substrates joined with rigid boards. The flexible layers are buried internally and completely penetrate the rigid sections of the PCB.

Available structures for rigid flex PCBs

There are numerous, different structures available. The more common ones are defined below:

Traditional rigid flex construction (IPC-6013 type 4) Multilayer rigid and flexible circuit combination containing three or more layers with plated through holes. Capability is 22L with 10L flex layers.
Asymmetrical rigid flex construction, where the FPC is situated on the outer layer of the rigid construction. Containing three or more layers with plated through holes.
Multilayer rigid flex construction with buried / blind via (microvia) as part of the rigid construction. 2 layers of microvia are achievable. Construction may also include two rigid structures as part of a homogeneous build. Capability is 2+n+2 HDI structure.

Rigid Flexible PCB that we made for customers:

4 Layers Rigid Flex Circuit Boards Fast Smt Contract Manufacturing

How can we guarantee quality? We do these actions to meet quality


1. 100% IQC check for all material incoming
2. Factory used ERP system to control lead time and quality , customer drawing (with size and spec.) will come with lot card on online board.
3. All Inner layer will do 100% AOI , and use plastic sheet between core to avoid scratch .
4. After lamination board we will do a cross section to Test board thickness and dielectric thickness .
5. On drill hole process , we use hole film to compare the board to Avoid hole missing or hole too big
6. On process , we would do cross section to Make sure hole wall copper .
7. For outer layer circuit , we do 100% AOI checking . for HDI board ,we would test board before solder mask
8. On solder mask process , we have inspect the board solder mask 100% .
9. 100% to testing finished board , if there is impedance control , we will do impedance control.

10. For production board , we would do first article board first .

4 Layers Rigid Flex Circuit Boards Fast Smt Contract Manufacturing

Shenzhen Yideyi Technology Co., Ltd is a turnkey PCB manufacturer who has over 15 years experience, we Good at HDI(anylayer), Multilayer(4-60L) , High frequency High speed,5G related PCB, Rigid-Flex , Flex PCB,BOM PROCUREMENT,Assembly and Function testing. The superior service we offer our customers high quality, technically advanced products within the customer’s timescales. This commitment, combined with the wealth of experience and expertise we have built up over the years, means we can offer a total solution to our customers from High end PCB FAB to Assembly ,Testing in time deliveries.

FAQ:

Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.

Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)

Q3. What’s the MOQ?
We are able to handle Small as well as large volume production with flexibility.

Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.

Q5. What is the main application of your PCBA service?

Industrial commander, and other industrial devices.

Medical equipments main board.

Security electronics

Communicative devices

New energy electronics

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